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20 similar journals ranked by semantic similarity (SPECTER2 embeddings)

#JournalPublisherFieldSimilarityJLCSOAAPC
1 IEEE Transactions on Components and Packaging Technologies Institute of Electrical and Electronics Engineers Electrical and Electronic Engineering 99.5% 55 No -
2 Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology - Electrical and Electronic Engineering 99.4% 15 No -
3 IEEE/CPMT International Electronics Manufacturing Technology Symposium Institute of Electrical and Electronics Engineers Electrical and Electronic Engineering 99.4% 35 No -
4 Journal of Surface Mount Technology Surface Mount Technology Association Electrical and Electronic Engineering 99.4% 55 Yes (hybrid) Free
5 Journal of Microelectronics and Electronic Packaging IMAPS - International Microelectronics Assembly and Packaging Society Electrical and Electronic Engineering 99.3% 55 Yes (hybrid) Free
6 Transactions of The Japan Institute of Electronics Packaging Japan Institute of Electronics Packaging Electrical and Electronic Engineering 99.3% 55 Yes (hybrid) Free
7 IMAPSource Proceedings IMAPS - International Microelectronics Assembly and Packaging Society Electrical and Electronic Engineering 99.3% 55 No -
8 International Symposium on Microelectronics IMAPS - International Microelectronics Assembly and Packaging Society Electrical and Electronic Engineering 99.2% 55 No -
9 The International Journal of Microcircuits and Electronic Packaging - Electrical and Electronic Engineering 99.2% 35 No -
10 Journal of Electronic Packaging ASME International Electrical and Electronic Engineering 99.1% 75 No -
11 Soldering and Surface Mount Technology Emerald (MCB UP) Electrical and Electronic Engineering 99.1% 75 No -
12 Journal of Electronics Manufacturing World Scientific Industrial and Manufacturing Engineering 99.0% 55 No -
13 Journal of the Microelectronics and Packaging Society - Electrical and Electronic Engineering 99.0% 55 Yes (hybrid) Free
14 Journal of The Japan Institute of Electronics Packaging Japan Institute of Electronics Packaging Electrical and Electronic Engineering 99.0% 55 No -
15 IEEE Transactions on Components Packaging and Manufacturing Technology Institute of Electrical and Electronics Engineers Electrical and Electronic Engineering 99.0% 75 No -
16 Circuit World Emerald (MCB UP) Electrical and Electronic Engineering 99.0% 75 No -
17 Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) IMAPS - International Microelectronics Assembly and Packaging Society Electrical and Electronic Engineering 99.0% 55 No -
18 Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology - Electrical and Electronic Engineering 98.9% 15 No -
19 Microelectronics International Emerald (MCB UP) Electrical and Electronic Engineering 98.8% 75 No -
20 IEEE Transactions on Advanced Packaging Institute of Electrical and Electronics Engineers Electrical and Electronic Engineering 98.7% 55 No -

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